Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces

ABSTRACT

Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece during mechanical or chemical-mechanical polishing. In this embodiment, the carrier head can include a retaining ring carried by a workpiece holder. The retaining ring can include an inner surface, an outer surface, and a base surface extending at least partially between the inner and outer surfaces. The retaining ring can further include at least one annular groove and a plurality of transverse grooves. The annular groove can be positioned adjacent to the base surface between the inner and outer surfaces. The plurality of transverse grooves can extend from the inner surface of the retaining ring to the annular groove in the base surface.

TECHNICAL FIELD

The following disclosure relates generally to mechanical and/orchemical-mechanical planarization of micro-device workpieces and, moreparticularly, to retaining rings for use with planarizing apparatuses.

BACKGROUND

Mechanical and chemical-mechanical planarization processes (collectively“CMP”) remove material from the surface of micro-device workpieces inthe production of microelectronic devices and other products. FIG. 1schematically illustrates a typical CMP machine 10 for performing achemical-mechanical planarization process. The CMP machine 10 includes aplaten 20, a carrier head 30, and a planarizing pad 40. The CMP machine10 can also include an under-pad 25 positioned between an upper surface22 of the platen 20 and a lower surface of the planarizing pad 40. Adrive assembly 26 rotates the platen 20 (indicated by arrow F) and/orreciprocates the platen 20 back and forth (indicated by arrow G).Because the planarizing pad 40 is attached to the under-pad 25, theplanarizing pad 40 moves with the platen 20 during planarization.

A micro-device workpiece 12 can be attached to a lower surface 32 of thecarrier head 30, or to a resilient pad 34 under the lower surface 32.The carrier head 30 may be a weighted, free-floating wafer carrier, oran actuator assembly 36 can be attached to the carrier head 30 to impartrotational motion to the micro-device workpiece 12 (indicated by arrowJ) and/or reciprocate the workpiece 12 back and forth (indicated byarrow I).

The planarizing pad 40 and a planarizing solution 44 define aplanarizing medium that mechanically and/or chemically-mechanicallyremoves material from the surface of the micro-device workpiece 12. Theplanarizing solution 44 may be a conventional CMP slurry with abrasiveparticles and chemicals that etch and/or oxidize the surface of themicro-device workpiece 12, or the planarizing solution 44 may be a“clean” non-abrasive planarizing solution without abrasive particles. Inmost CMP applications, abrasive slurries with abrasive particles areused on non-abrasive polishing pads, and clean non-abrasive solutionswithout abrasive particles are used on fixed-abrasive polishing pads.

To planarize the micro-device workpiece 12 with the CMP machine 10, thecarrier head 30 presses the workpiece 12 face-downward against theplanarizing pad 40. More specifically, the carrier head 30 generallypresses the micro-device workpiece 12 against the planarizing solution44 on a planarizing surface 42 of the planarizing pad 40, and the platen20 and/or the carrier head 30 moves to rub the workpiece 12 against theplanarizing surface 42. As the micro-device workpiece 12 rubs againstthe planarizing surface 42, the planarizing medium removes material fromthe face of the workpiece 12.

The force generated by friction between the micro-device workpiece 12and the planarizing pad 40 during planarization will, at any giveninstant, be exerted against the workpiece 12 primarily in the directionof relative movement between the workpiece 12 and the planarizing pad40. A retaining ring 33 can be used to counteract this force and holdthe micro-device workpiece 12 in position. The retaining ring 33 extendsdownwardly from the carrier head 30 and contacts the planarizing surface42 around the micro-device workpiece 12.

The planarity of the finished micro-device workpiece surface is afunction of the distribution of planarizing solution 44 under theworkpiece 12 during planarization and several other factors. Thedistribution of planarizing solution 44 is a controlling factor for thedistribution of abrasive particles and chemicals under the workpiece 12,as well as a factor affecting the temperature distribution across theworkpiece 12. In certain applications it is difficult to control thedistribution of planarizing solution 44 under the micro-device workpiece12 because the retaining ring 33 wipes some of the solution 44 off ofthe planarizing pad 40. Moreover, the retaining ring 33 can preventproper exhaustion of the planarizing solution 44 from inside theretaining ring 33, causing a build-up of the planarizing solution 44proximate to the trailing edge. These problems cause an unevendistribution of abrasive particles and chemicals under the micro-deviceworkpiece that result in non-uniform and uncontrollable polishing ratesacross the workpiece.

To solve this problem, some retaining rings have grooves. Theseretaining rings, however, may not be very effective at exhausting theplanarizing solution. Various examples of retaining rings with groovesare described in detail in U.S. Pat. No. 6,869,335 to Taylor; U.S. Pat.No. 6,224,472 to Lai et al.; U.S. Pat. No. 6,267,643 to Teng et al.;U.S. Pat. No. 5,944,593 to Chiu et al.; and US Patent Publication No.2002/0182867 of Kajiwara et al., published Dec. 5, 2002. Each of thesepatents and the patent publication is incorporated in the presentapplication in its entirety by reference.

FIG. 2 schematically illustrates another rotary CMP machine 110 with afirst platen 120 a, a second platen 120 b, a first carrier head 130 a,and a second carrier head 130 b. On the CMP machine 110, the firstcarrier head 130 a rotates in a first direction D₁, and the secondcarrier head 130 b rotates in a second direction D₂. Because the carrierheads 130 a-b rotate in different directions, retaining rings withdifferent grooves are used for each carrier head 130 a-b. The use of twodifferent retaining rings increases inventory costs and can result inthe wrong ring being placed on a carrier head 130.

SUMMARY

This summary is provided for the benefit of the reader only, and is notintended to limit the invention as set forth by the claims.

The present invention relates to retaining rings and associatedplanarizing apparatuses, and related methods for planarizingmicro-device workpieces. A carrier head configured in accordance withone aspect of the invention can be used to retain a micro-deviceworkpiece during mechanical or chemical-mechanical polishing. Thecarrier head can include a retaining ring carried by a workpiece holder.The retaining ring can include an inner annular surface, an outerannular surface, and a base surface extending at least partially betweenthe inner and outer surfaces. In addition, the retaining ring canfurther include an annular groove and a plurality of transverse grooves.The annular groove can be positioned adjacent to the base surfacebetween the inner and outer surfaces. The plurality of transversegrooves can extend from the inner surface to the annular groove. In oneembodiment, each of the transverse grooves can intersect the annulargroove at an angle of about 90°. In another embodiment, one or more ofthe transverse grooves can intersect the annular groove at an obliqueangle.

A carrier head configured in accordance with another aspect of theinvention includes a retaining ring carried by a workpiece holder. Theretaining ring can include an inner wall, an outer wall, and a basesurface extending at least partially between the inner and outer walls.The base surface can include an annular channel, a first plurality oftransverse channels, and a second plurality of transverse channels. Thefirst and second pluralities of transverse channels can extend from theinner wall of the annular ring to the annular channel. Further, thefirst plurality of transverse channels can be configured to pump aplanarizing solution into the retaining ring when the retaining ring isrotated in a first direction, and the second plurality of transversechannels can be configured to exhaust the planarizing solution from theretaining ring when the retaining ring is rotated in the firstdirection. In one embodiment, one or more of the transverse channels canextend all the way across the base surface of the retaining ring fromthe inner wall to the outer wall. In another embodiment, the annularchannel can be a first annular channel, and the retaining ring canfurther include a second annular channel positioned adjacent to thefirst annular channel.

A machine for polishing micro-device workpieces in accordance with afurther aspect of the invention can include a table, a planarizing padcoupled to the table, and a workpiece carrier assembly having a drivesystem operably coupled to a carrier head. The carrier head can includea retaining ring carried by a workpiece holder. The retaining ring caninclude an inner surface, an outer surface, and a base surface extendingat least partially between the inner and outer surfaces. The retainingring can also include an annular groove positioned adjacent to the basesurface between the inner and outer surfaces, and a plurality oftransverse grooves extending at least from the inner surface to theannular groove.

A method of polishing a micro-device workpiece in accordance withanother aspect of the invention can include positioning the workpieceproximate to an inner surface of a retaining ring, and applying asolution to a polishing pad. The method can further include rotating theretaining ring relative to the polishing pad in a first direction, andpassing at least a portion of the solution from the inner surface of theretaining ring to an annular groove in the retaining ring through atleast one transverse groove in the retaining ring. In one embodiment,the transverse groove can be a first transverse groove having a firstorientation in the retaining ring, and the method can further includepassing at least a portion of the solution from the annular groove tothe inner surface through at least a second transverse groove in theretaining ring. In this embodiment, the second transverse groove canhave a second orientation in the retaining ring that is different thanthe first orientation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view illustrating a portion of arotary planarizing machine configured in accordance with the prior art.

FIG. 2 is a top plan view illustrating a portion of another rotaryplanarizing machine configured in accordance with the prior art.

FIG. 3A is a schematic cross-sectional view illustrating a portion of arotary planarizing machine having a carrier head with a retaining ringconfigured in accordance with an embodiment of the invention.

FIG. 3B is an enlarged cross-sectional view of a portion of theretaining ring of FIG. 3A.

FIG. 4 is a bottom plan view of the retaining ring of FIGS. 3A and 3B.

FIG. 5 is a bottom plan view of a retaining ring configured inaccordance with another embodiment of the invention.

FIGS. 6A and 6B are bottom plan views of portions of retaining ringsconfigured in accordance with further embodiments of the invention.

FIG. 7 is a bottom plan view of a portion of a retaining ring configuredin accordance with another embodiment of the invention.

FIG. 8 is a bottom plan view of a portion of a retaining ring configuredin accordance with a further embodiment of the invention.

FIG. 9 is a bottom plan view of a portion of a retaining ring configuredin accordance with another embodiment of the invention.

DETAILED DESCRIPTION

The present invention is directed generally to retaining rings,associated planarizing apparatuses, and related methods for mechanicaland/or chemical-mechanical planarization of micro-device workpieces. Theterm “micro-device workpiece” is used throughout the present disclosureto refer to substrates upon which or in which microelectronic devices,micromechanical devices, data storage elements, and other features canbe fabricated. Such micro-device workpieces can include, for example,semi-conductor wafers, glass substrates, insulated substrates, etc.Furthermore, the terms “planarization” and “planarizing” can refer toforming a planar and/or smooth surface (e.g., “polishing”). Moreover,the term “transverse” can mean oblique, perpendicular, and/or notparallel.

Specific details are set forth in the following description and in FIGS.3A-9 to provide a thorough understanding of various embodiments of theinvention. One skilled in the art will understand, however, that thepresent invention may have additional embodiments, or that otherembodiments of the invention can be practiced without several of thespecific features described below.

FIG. 3A is an elevation view schematically illustrating a rotary CMPmachine 310 with a table or platen 320, a carrier head 330, and aplanarizing pad 340. The platen 320 can be a stationary platen or arotary platen. The platen 320 and the pad 340 can be similar instructure and function to the platen 20 and the pad 40 described abovewith reference to FIG. 1. For example, the pad 340 can have aplanarizing surface 342 upon which a micro-device workpiece 312 isplanarized in the presence of a slurry or another type of planarizingsolution 44.

In one aspect of this embodiment, the carrier head 330 includes aworkpiece holder or carrier 331. The workpiece carrier 331 includes alower surface 332 to which a backing member 334 is attached. Themicro-device workpiece 312 is positioned between the backing member 334and the planarizing pad 340. The backing member 334 can be operablycoupled to a movable back plate, membrane, and/or other apparatusconfigured to selectively exert a downward force upon the micro-deviceworkpiece 312 during planarization. In other embodiments, the backingmember 334 can be omitted and the micro-device workpiece 312 can beattached to the lower surface 332 of the workpiece carrier 331.

In another aspect of this embodiment, the carrier head 330 furtherincludes a retaining ring 333 configured to prevent the micro-deviceworkpiece 312 from slipping relative to the workpiece carrier 331 duringthe planarizing process. In the illustrated embodiment, the retainingring 333 is circular and extends around the outside of the micro-deviceworkpiece 312 to hold the micro-device workpiece 312 in position as theworkpiece carrier 331 rubs it against the pad 340. The retaining ring333 can have a diameter greater than the micro-device workpiece 312 ifdesirable to allow the workpiece 312 to precess relative to theworkpiece carrier 331 during the planarizing process.

The retaining ring 333 can be configured to move upwardly and downwardlyrelative to the workpiece carrier 331 if needed to adjust the relativepressures exerted by the retaining ring 333 and the micro-deviceworkpiece 312 against the pad 340. Adjusting these pressures may benecessary and/or advantageous to maintain an adequate hold on themicro-device workpiece 312 during planarization while at the same timeproviding a superior surface finish. For example, in one embodiment ofthe present invention, the retaining ring 333 can be configured to exerta ring pressure against the pad 340 which is equal to about twice a padpressure exerted by the micro-device workpiece 312 against the pad 340.In other embodiments, the ring pressure and the pad pressure can haveother relative values. For example, in one other embodiment described ingreater detail below, the ring pressure can be reduced relative to thepad pressure such that the ratio is less than 2:1, such as about 1.5:1.Reducing ring pressure in this manner can advantageously reduce padglazing and wear, particle generation, and workpiece edge defectsresulting from pad rebound.

FIG. 3B is a enlarged cross-sectional view illustrating a portion of theretaining ring 333 in greater detail. The retaining ring 333 includes abase surface 350 extending at least partially between an inner surface352 and an outer surface 354. The micro-device workpiece 312 ispositioned within the retaining ring 333 such that an outer edge 313 ofthe micro-device workpiece 312 is positioned proximate to the innersurface 352 of the retaining ring 333. The inner surface 352 is therebyable to exert a force against the outer edge 313 as needed to retain themicro-device workpiece 312 in the proper position during polishing.

The base surface 350 of the retaining ring 333 contacts the planarizingsolution 44 and the planarizing pad 340. As a result, the outer surface354 and the base surface 350 sweep the planarizing solution 44 acrossthe pad 340 during the planarizing process. With conventional retainingrings (such as the retaining rings described above with reference toFIGS. 1 and 2), this sweeping effect often prevents the planarizingsolution 44 from sufficiently entering and/or exiting the wafer cavityduring the planarizing process. As described in greater detail below,however, the retaining ring 333 of the present invention can include atleast one annular channel or groove 360 and a plurality of transversechannels or grooves 370 (only one transverse groove is shown in FIG. 3B)to facilitate the flow of planarizing solution 44 into and/or out of thewafer cavity during planarization.

FIG. 4 is a bottom plan view of the retaining ring 333 of FIGS. 3A and3B configured in accordance with an embodiment of the invention. In theillustrated embodiment, the transverse grooves 370 are uniformly spacedaround the retaining ring 333 and extend from the inner surface 352 tothe annular groove 360. Furthermore, in this particular embodiment thetransverse grooves 370 are at least approximately straight and intersectthe annular groove 360 at right angles (e.g., radial with respect to thering 333). In other embodiments described in detail below, however, theretaining ring 330 or various embodiments thereof can include aplurality of transverse grooves extending in various curved paths and/orintersecting the annular groove 360 at various oblique angles.Regardless of groove orientation, the intersection of the base surface350 with one or more groove sidewalls 480 can be beveled, rounded, etc.to avoid excessive wear to the planarizing pad 340 (FIG. 2) during theplanarizing process.

In the illustrated embodiment, the tranverse grooves 370 can have afirst width W₁, of about 0.025 inch and a corresponding depth D (FIG. 3)of about 0.025 inch. The annular groove 360 can have a width of W₂ ofabout 0.025 inch and a corresponding depth D of about 0.025 inch. Inother embodiments, the widths W and the depth D of the transversegrooves 370 and the annular groove 360 can have other dimensions asrequired to provide desirable planarizing characteristics.

FIG. 5 is a bottom plan view of a retaining ring 533 configured inaccordance with another embodiment of the invention. Many features ofthe retaining ring 533 are at least generally similar in structure andfunction to the retaining ring 333 described above with reference toFIGS. 3A-4. In this particular embodiment, however, the retaining ring533 includes a first annular groove 560 a and an adjacent second annulargroove 560 b formed in a base surface 550. In addition, transversegrooves 570 extend outwardly from an inner surface 552 of the retainingring 533 and intersect both the first annular groove 560 a and thesecond annular groove 560 b. In the illustrated embodiment, thetransverse grooves 570 terminate before reaching an outer surface 554 ofthe retaining ring 533. In other embodiments described in greater detailbelow, however, the transverse grooves can extend all the way across thebase surface of the retaining ring.

During the planarizing process, the annular grooves 560 (and 360 in FIG.4) can act as planarizing solution reservoirs that prevent theplanarizing solution 44 (FIG. 3B) from accumulating along a trailingedge 558 of the retaining ring 533 as the retaining ring 533 moves in alinear direction 1 ₁. In addition, the transverse grooves 570 can act astransport channels that direct the planarizing solution 44 into and/orout of the annular grooves 560 as required to maintain a relatively evendistribution of planarizing solution 44 on the planarizing pad 340 inthe wafer cavity. Controlling the amount of planarizing solution 44applied to the micro-device workpiece 312 in this manner can lead tobetter planarity results from the polishing process. Further, theplanarizing rate can be improved by controlling planarizing solutiontransport to the workpiece cavity.

Another expected advantage of the embodiments illustrated in FIGS. 4 and5 is that the annular groove (or grooves) in the retaining rings cancontrol pad rebound during the planarizing process. Controlling theextent and location of pad rebound can help to minimize surfacevariations and control the edge profile of the micro-device workpieceduring the planarizing process. Yet another expected advantage of theillustrated embodiments is that the relative pressure exerted againstthe planarizing pad 340 by the retaining ring 533 can be reduced withoutincreasing the likelihood of work-piece slippage. This can reduce wearand/or glazing of the planarizing pad 340, while also reducinggeneration of pad debris. Yet another expected advantage of the annulargrooves disclosed herein is that they lower the impeded transportdistance for slurry moving into or out of the planarizing cavity, incontrast to other retaining rings wherein the planarizing solution mustpass beneath the full width of the retaining ring base surface.

Although the transverse grooves 370 and 570 described above withreference to FIGS. 4 and 5 do not extend all the way across the basesurfaces of the respective retaining rings 333 and 533, retaining ringsconfigured in accordance with other embodiments of the invention caninclude one or more transverse grooves that do extend all the way acrossthe base surface. Examples of such retaining rings are illustrated inFIGS. 6A and 6B. Referring first to FIG. 6A, a retaining ring 633 aincludes an annular groove 660 a and a plurality of transverse grooves670 a that extend across the full width of a base surface 650 from aninner surface 652 to an outer surface 654. In FIG. 6A, the transversegrooves 670 a extend in a relatively straight path across the basesurface 650. In contrast, FIG. 6B illustrates a retaining ring 633 bhaving a plurality of first transverse grooves 671 that are staggeredrelative to a corresponding plurality of second transverse grooves 672.

FIG. 7 is a bottom plan view of a retaining ring 733 configured inaccordance with another embodiment of the invention. The retaining ring733 includes a plurality of transverse grooves 770 that extend from aninner surface 752 to an annular groove 760. In the illustratedembodiment, the transverse grooves 770 include a plurality of firstgrooves 710 and a plurality of corresponding second grooves 720. Eachfirst groove 710 intersects the adjacent second groove 720 at a point ofintersection 712 proximate to the annular groove 760. Further, eachfirst groove 710 forms an angle β with the adjacent second groove 720.In one embodiment, the angle β can be about 110°. In other embodiments,the angle β can be equal to or greater than 60° and/or less than 180°.In still further embodiments, some of the groove pairs can includetransverse grooves that intersect at different angles.

The orientation of the transverse grooves 770 can prevent theplanarizing solution 44 (FIG. 3) from accumulating against a trailingedge 758 of the retaining ring 733 during planarization. For example, asthe retaining ring 733 rotates in a first direction J₁ and translates ina linear direction I₁, the planarizing solution 44 and associatedabrasive particles in a wafer cavity 780 can flow into the annulargroove 760 through the second grooves 720 along path E. This allows forproper exhaustion of excess planarizing solution 44 from the wafercavity 780. Similarly, this same motion of the retaining ring 733 cancause the planarizing solution 44 in the annular groove 760 to flow backinto the wafer cavity 780 through the first grooves 710 along path P.This allows for proper distribution of the planarizing solution in thewafer cavity 780 for contact with the micro-device workpiece 312 (FIG.3) during the planarizing process. In the foregoing manner, theorientation of the transverse grooves 770 allows for a more evendistribution of the planarizing solution 44 during the planarizingprocess by preventing accumulation of the planarizing solution 44proximate to the inside of the trailing edge 758 of the retaining ring733.

Another expected advantage of the illustrated embodiment is that theretaining ring 733 will function properly regardless of the direction ofrotation. For example, when the retaining ring 733 is rotated in asecond direction J₂, the planarizing solution 44 flows into the annulargroove 760 through the first transverse grooves 710, and out of theannular groove 760 through the second transverse groove 720.Accordingly, the retaining ring 733 can be used with either workpiececarrier in those CMP machines having two or more carrier heads thatcounter rotate during the planarizing process. This versatility reducesinventory costs and the likelihood of placing the wrong retaining ringon a particular workpiece carrier.

FIGS. 8 and 9 are bottom plan views of portions of retaining rings 833and 933, respectively, configured in accordance with other embodimentsof the invention. Referring first to FIG. 8, the retaining ring 833includes an annular groove 860 and a plurality of transverse grooves870. The transverse grooves 870 have a radius of curvature R, and extendfrom an inner surface 852 of the retaining ring 833 to the annulargroove 860. One advantage of this configuration is that the curvedtransverse grooves 870 can facilitate transport of the planarizingsolution 44 (FIG. 3) into and/or out of the retaining ring 833 duringthe planarizing process. Further, although all of the transverse grooves870 illustrated in FIG. 8 intersect the annular groove 860 at the sameangle, in other embodiments, the retaining ring 833 can include aplurality of transverse grooves which intersect the annular groove 860at different angles.

Referring next to FIG. 9, the retaining ring 933 includes a first groove910 and a second groove 920 that intersect at an intersection 912proximate to an annular groove 960, thereby creating an “X” pattern. Inthe illustrated embodiment, the first groove 910 is oriented at an anglep with respect to the second groove 920. The intersection of the firstgroove 910 and the second groove 920 creates a plurality of cornerpoints, (e.g., such as a first corner point 922 and a second cornerpoint 924) on a base surface 950 of the retaining ring 933. Each ofthese corner points 922 and 924 can cause wear on the planarizing pad340 (FIG. 3) as the retaining ring 933 moves relative to the planarizingpad 340 during the planarizing process. Accordingly, one advantage ofthe embodiments illustrated in FIGS. 3A-8 is that the number of cornerpoints is reduced, thereby reducing the amount of wear and/or debristhat is generated on the surface of the planarizing pad 340 during theplanarizing process.

Although various retaining rings have been described above, in otherembodiments of the invention, various features of these retaining ringscan be combined or omitted to create other retaining rings configured inaccordance with the present invention. These other retaining rings caninclude one or more annular grooves and one or more transverse groovesat similar or different orientations, and/or at different spacing aroundthe retaining ring. Further, such rings can be made from a single pieceof material or a plurality of pieces or sections of materia.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from thespirit and scope of the invention. For example, aspects of the inventiondescribed in the context of particular embodiments may be combined oreliminated in other embodiments. Further, while advantages associatedwith certain embodiments of the invention have been described in thecontext of those embodiments, other embodiments may also exhibit suchadvantages, and not all embodiments need necessarily exhibit suchadvantages to fall within the scope of the invention. Accordingly, theinvention is not limited, except as by the appended claims.

1-43. (canceled)
 44. A method of manufacturing a retaining ring forretaining a micro-device workpiece during planarization, the methodcomprising: forming an annular groove in the retaining ring; and forminga plurality of transverse grooves in the retaining ring that intersectthe annular groove, the plurality of transverse grooves extending froman inner surface of the retaining ring and terminating before reachingan outer surface of the retaining ring.
 45. The method of claim 44wherein forming a plurality of transverse grooves in the retaining ringincludes forming a first plurality of transverse grooves at a firstorientation relative to the inner surface, and wherein the methodfurther comprises making a second plurality of transverse grooves in theretaining ring at a second orientation relative to the inner surface.46. The method of claim 44 wherein making a second plurality oftransverse grooves includes forming the second plurality of transversegrooves such that each of the second plurality of transverse groovesintersects a corresponding groove in the first plurality of transversegrooves proximate to the inner surface.
 47. The method of claim 44wherein the annular groove is a first annular groove, and wherein themethod further comprises forming a second annular groove in theretaining ring.
 48. The method of claim 44 wherein the annular groove isa first annular groove, wherein the method further comprises forming asecond annular groove in the retaining ring, and wherein forming aplurality of transverse grooves in the retaining ring includes forming aplurality of transverse grooves that intersect the first and secondannular grooves. 49-53. (canceled)
 54. The method of claim 44 whereinforming an annular groove in the retaining ring includes forming theannular groove in a base surface of the retaining, the base surfaceextending between the inner and outer surfaces of the retaining ring.55. The method of claim 44 wherein forming a plurality of transversegrooves in the retaining ring includes forming a first plurality oftransverse grooves at a first orientation relative to the inner surface,and wherein the method further comprises forming a second plurality oftransverse grooves in the retaining ring at a second orientationrelative to the inner surface, the second plurality of transversegrooves extending from the inner surface of the retaining ring andterminating before reaching the outer surface of the retaining ring. 56.The method of claim 44 wherein forming a plurality of transverse groovesin the retaining ring includes forming a plurality of curved groovesthat intersect the annular groove at an angle, the plurality of curvedgrooves terminating at the annular groove.
 57. A method of manufacturinga retaining ring for retaining a micro-device workpiece duringplanarization, the method comprising: forming an annular groove in abase surface of the retaining ring, the base surface being at leastgenerally flat and extending between a cylindrical inner surface of theretaining ring and a cylindrical outer surface of the retaining ring;and forming a plurality of transverse grooves in the base surface of theretaining ring that intersect the annular groove at an angle differentthan 90 degrees, the plurality of transverse grooves extending from theinner surface of the retaining ring and terminating before reaching theouter surface of the retaining ring.
 58. The method of claim 57 whereinforming a plurality of tranverse grooves includes forming a plurality oftransverse grooves each having a width of about 0.025 inch.
 59. Themethod of claim 57 wherein forming a plurality of tranverse groovesincludes forming a plurality of transverse grooves each having a widthof about 0.025 inch and a depth of about 0.025 inch.
 60. The method ofclaim 57 wherein forming a plurality of tranverse grooves includesforming a plurality of curved grooves.
 61. The method of claim 57,further comprising: shaping the inner surface of the retaining ring toextend around the outside of a workpiece carrier; and configuring theretaining ring to be movably attached to a carrier head proximate to theworkpiece carrier, whereby the retaining ring is movable relative to theworkpiece carrier.
 62. A method of manufacturing a retaining ring foruse with a carrier head in a micro-device workpiece polishing machine,the method comprising: forming an annular groove in a base surface ofthe retaining ring, the base surface being at least generally flat andextending between an inner surface of the retaining ring and an outersurface of the retaining ring; forming a first plurality of transversegrooves in the base surface of the retaining ring that intersect theannular groove in a first orientation, the first plurality of transversegrooves extending from the inner surface of the retaining ring andterminating before reaching the outer surface of the retaining ring;forming a second plurality of transverse grooves in the base surface ofthe retaining ring that intersect the annular groove in a secondorientation different than the first orientation, the second pluralityof transverse grooves extending from the inner surface of the retainingring and terminating before reaching the outer surface of the retainingring; and configuring the retaining ring to be movably attached to thecarrier head around the outside of a workpiece carrier.
 63. The methodof claim 62 wherein the annular groove is a first annular groove, andwherein the method further comprises forming a second annular groove inthe base surface of the retaining ring.
 64. The method of claim 62wherein the annular groove is a first annular groove, wherein the methodfurther comprises forming a second annular groove in the base surface ofthe retaining ring, and wherein forming a first plurality of transversegrooves in the retaining ring includes forming a first plurality oftransverse grooves that intersect the first and second annular grooves.